Principal ASIC Physical Design Engineer

I help teams get difficult ASICs to closure.

I bring more than 30 years of semiconductor engineering experience to complex physical-design programs—especially when timing, constraints, power, implementation, and signoff stop behaving like separate problems.

Client Value

What I can do for your ASIC program

My role is not simply to run a flow. It is to find the real reason a design is not converging, make the right engineering tradeoffs, and help move the program toward signoff and tape-out.

Own difficult implementation problems

Work across floorplanning, placement, CTS, routing, ECO, congestion, and signoff instead of treating them as isolated tasks.

Drive timing closure

PrimeTime, Tempus, SDC, MMMC, setup/hold analysis, clock-path behavior, ECO strategy, and signoff correlation.

Connect timing, power, and physical reality

UPF, PrimePower/PT-PX, Voltus, RedHawk, IR/EM, parasitics, and implementation decisions that affect signoff.

Improve engineering execution

Tcl, Python, shell, flow automation, methodology development, debug discipline, and cross-functional technical leadership.

Technical Articles

How I think about physical design

Practical articles on timing closure, constraints, ECO, floorplanning, power, signoff, and lessons learned through repeated tape-outs.

01

Timing Closure Is Not Just Fixing Negative Slack

Published

02

The Last 100 ps: Why Late-Stage Timing Closure Is So Difficult

Published

03

Before Fixing a Timing Violation, Make Sure It Is a Real Violation

Available Monday, September 21, 2026

04

Floorplanning Decisions You Pay for During Timing Closure

Available Monday, September 28, 2026

05

How I Debug a Timing Violation Before Touching the Netlist

Available Monday, October 5, 2026

06

SDC Quality Can Make or Break Physical Design

Available Monday, October 12, 2026

07

MMMC: Why More Scenarios Do Not Automatically Mean Better Signoff

Available Monday, October 19, 2026

08

Clock Trees: Skew Is Only Part of the Problem

Available Monday, October 26, 2026

09

When Should You Fix Timing in P&R vs. PrimeTime ECO?

Available Monday, November 2, 2026

10

IR Drop and Timing Closure Are More Connected Than Many Designers Think

Available Monday, November 9, 2026

11

UPF Problems That Become Physical-Design Problems

Available Monday, November 16, 2026

12

Congestion, Timing, and Power: The Three-Way Tradeoff in Advanced Nodes

Available Monday, November 23, 2026

13

What 19+ Tape-outs Teach You That a Flow Manual Does Not

Available Monday, November 30, 2026

14

Can AI Really Help Close Timing? A Physical Designer’s Perspective

Available Monday, December 7, 2026

15

What Makes a Physical Design Engineer Principal-Level?

Available Monday, December 14, 2026

Core Capabilities

Principal-level physical design coverage

RTL / Netlist to GDSII

Floorplanning, placement, CTS, routing, optimization, ECO, physical verification, signoff, and tape-out.

STA & Timing Closure

PrimeTime, Tempus, SDC, MMMC, setup/hold closure, clock analysis, WNS/TNS, and timing ECO.

Power & Low Power

PrimePower/PT-PX, Voltus, RedHawk, UPF, dynamic/leakage analysis, and IR/EM.

Physical Verification

Calibre, IC Validator/VUE, DRC, LVS, ERC, DFM, antenna, and tape-out readiness.

Advanced Nodes

Experience across multiple technology generations, including TSMC designs down to 4nm.

EDA Automation

Tcl, Python, shell, Makefile, SED/AWK, and methodology development for repeatable execution.

Background

Research depth. EDA breadth. Production tape-out experience.

My career spans IBM Research, EDA companies, semiconductor organizations, and advanced technology programs. That range matters because difficult physical-design problems rarely belong to one tool or one flow stage.

The complete employment history, education, certifications, and client engagements remain in the résumé so the landing page stays focused on what I can do for a client.

View Full Resume
IBM ResearchSemiconductor R&D, patents, publications, and advanced CMOS work
EDA experienceSynopsys and Cadence implementation, timing, signoff, and methodology
Advanced clientsAmazon, Meta, Google, Microsoft, Broadcom, Intel, AMD, and others
EducationMSEE, BSEE with Honors, and applied AI/ML professional education
For ASIC & EDA Engineers

Interested in working with me through Athena Cloud Engineers?

I am building a network of experienced engineers who can support client ASIC programs in physical design, STA, power, verification, automation, and related semiconductor disciplines.

Work With Me

Need experienced hands on a difficult ASIC?

If your program needs principal-level physical-design judgment, timing-closure depth, signoff experience, or help resolving a design that is not converging, contact me.